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Brand Name : HUASWIN
Model Number : HSPCBA1019
Certification : ISO/UL/RoHS
Place of Origin : China
MOQ : 1 sets
Price : Negotiation
Payment Terms : T/T, Western Union, L/C
Supply Ability : 10,000pcs per month
Delivery Time : 15-20 working days
Packaging Details : Anti-static bag + Anti-static bubble wrap + Good quality carton box
From schematic... through layout, fabrication, and assembly..
 We strive to meet your needs!
* Electronic Design Engineering
* PCB Design and Layout
* Complete PCB Fabrication
* Custom & High Temp materials
* BGA/LGA, Blind/Buried Vias, Controlled Impedance, Differential Pairs
* Production and Inventory Control
* Turn-key Parts Procurement, Assembly 
* Testing & Packaging Services
* Quality Electronic/Electro-Mechanical Assembly.
* ESD Safety
* Process Routing - Specific for each job
* ROHS Compliance 
* Complete Document Control:
- Engineering Change Order
- Serialization of Assemblies & Cables for Tracking
- Modification Procedure
- Revision Control/Prints
- Deviation Forms
* Surface Mount Technology
* Mixed Technology Board Assemblies
* Rework & Handwiring
Detailed Specification of PCB Manufacturing
| 1 | layer | 1-30 layer | 
| 2 | Material | CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. | 
| 3 | Board thickness | 0.2mm-6mm | 
| 4 | Max.finished board size | 800*508mm | 
| 5 | Min.drilled hole size | 0.25mm | 
| 6 | min.line width | 0.075mm(3mil) | 
| 7 | min.line spacing | 0.075mm(3mil) | 
| 8 | Surface finish | HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP | 
| 9 | Copper thickness | 0.5-4.0oz | 
| 10 | Solder mask color | green/black/white/red/blue/yellow | 
| 11 | Inner packing | Vacuum packing,Plastic bag | 
| 12 | Outer packing | standard carton packing | 
| 13 | Hole tolerance | PTH:±0.076,NTPH:±0.05 | 
| 14 | Certificate | UL,ISO9001,ISO14001,ROHS,TS16949 | 
| 15 | Profiling punching | Routing,V-CUT,Beveling | 
Detailed Specification of Pcb Assembly
| 1 | Type of Assembly | SMT and Thru-hole | 
| 2 | Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free | 
| 3 | Components | Passives Down to 0201 Size | 
| BGA and VFBGA | ||
| Leadless Chip Carries/CSP | ||
| Double-Sided SMT Assembly | ||
| Fine Pitch to 08 Mils | ||
| BGA Repair and Reball | ||
| Part Removal and Replacement-Same Day Service | ||
| 3 | Bare Board Size | Smallest:0.25x0.25 Inches | 
| Largest:20x20 Inches | ||
| 4 | File Formats | Bill of Materials | 
| Gerber Files | ||
| Pick-N-Place File(XYRS) | ||
| 5 | Type of Service | Turn-Key,Partial Turn-Key or Consignment | 
| 6 | Component Packaging | Cut Tape | 
| Tube | ||
| Reels | ||
| Loose Parts | ||
| 7 | Turn Time | 15 to 20 days | 
| 8 | Testing | AOI inspection | 
| X-Ray inspection | ||
| In-Circuit testing | ||
| Functional test | 
Quality Assurance: 
 
Our Quality processes include: 
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection for every process 
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008
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